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Diamond Flexible Polishing Pads (JDK-KL027)

Basic Info

Model No.:  JDK-KL027

Product Description

Model NO.: JDK-KL027 Abrasive: Natural Abrasives Types: Polishing Working Style: Surface Grinding Outer Diameter: 150-250mm Application: Wet/Dry Thickness: 2.2/3.0mm Trademark: JDK Origin: Fujian, China Material: Silicon Carbide Shapes: With Handle Grain Size: 50#--3000# Pad Material: Diamond Size: 80-150mm Grit: 50-Buff Supply Type: Make-to-Order Specification: ISO&CE HS Code: 82023100 Description:
Diamond Flexible Polishing Pads be used wet and dry are widely used to polish stone, porcelain profiles, ceramic tile floors, all kinds if table-boards and stone sculptures, Pads attach to a backera with durable velcro connection and installed on potable Grinding Machine and operated by hand.
Diametion size: 80mm, 100mm, 125mm, 150mm available
Application:
1. Special for granite, marble polishing
2. Using with water Max RPM 4500
3. Suitable for hand polishing machine
4. Designed from soft to hard for different
Step 1: #50 for Aggressive coarse grinding
Step 2: #100 for Coarse grinding.
Step 3: #200 for Semi Coarse grinding
Step 4: #400 for Soft grinding / medium polishing
Step 5: #800 for Extra polishing
Step 6: #1500, #3000 for Final polishing
Step 7: BUFF for Buffing

Diameter

GRIT No.

80mm

3"

50#

100#

200#

400#

800#

1500#

3000#

Buff

60#

150#

300#

500#

1000#

2000#

3000#

Buff

100mm

4"

50#

100#

200#

400#

800#

1500#

3000#

Buff

60#

150#

300#

500#

1000#

2000#

3000#

Buff

125mm

5"

50#

100#

200#

400#

800#

1500#

3000#

Buff

60#

150#

300#

500#

1000#

2000#

3000#

Buff

150mm

6"

 

50#

100#

200#

400#

800#

1500#

3000#

Buff

60#

150#

300#

500#

1000#

2000#

3000#

Buff

Shape

Normal or Turbo(Spiral Type)

Use Type

Dry Use or Wet Use

Thickness

1.2mm for Dry Pads, 2.2-5mm for Wet Pads(Normal Thickness: 2.2 / 3.0mm)

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Product Categories : Diamond Polishing Pads